تأثیر زمان اتصال بر ریزساختار و تکمیل انجماد ایزوترم در خلال اتصال TLP سوپر آلیاژهای پایه نیکل غیرمشابه IN738LC و Nimonic 75

نوع مقاله : علمی-پژوهشی

نویسندگان

1 دکتری مهندسی مواد و متالورژی، مدیر مهندسی بازسازی شرکت مهندسی موادکاران- مپنا، کرج، ایران.

2 کارشناس ارشد مهندسی مواد و متالورژی، مدیر مهندسی بازسازی قطعات هوایی شرکت مهندسی موادکاران- مپنا، کرج، ایران.

3 استاد، دانشگاه آزاد اسلامی، واحد علوم و تحقیقات، دانشکده مهندسی مواد و متالورژی، تهران، ایران.

چکیده

اتصال سوپر آلیاژهای پایه نیکل اینکونل 738 و نایمونیک 75 با استفاده از لایه واسط حاوی Ni-Cr-B و با نام تجاری MBF-80 توسط فرآیند فاز مایع گذرا (TLP) در دماهای ℃1080، ℃1120، ℃1150 و ℃1180 و زمان‌های مختلف انجام شد. ریزساختار اتصال با استفاده از میکروسکوپ الکترونی روبشی (SEM) و میکروسکوپ نوری مورد مطالعه قرار گرفت. بررسی‌های ریزساختاری نشان داد که در زمان‌های کوتاه اتصال، ریزساختار شامل فازهای بین فلزی یوتکتیکی پیوسته در خط مرکزی اتصال می‌باشد و با افزایش زمان اتصال در دمای ثابت به‌تدریج از پیوستگی آن کم و نهایتاً به‌طور کامل حذف می‌شوند. به‌منظور پیش‌بینی زمان لازم برای تکمیل انجماد ایزوترم از معادلات نفوذ فیک استفاده شد و مشاهده گردید که تطابق خوبی بین زمان پیش‌بینی شده برای تکمیل انجماد ایزوترم و نتایج تجربی وجود دارد.

کلیدواژه‌ها


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[1] O. A. Ojo, "On liquation cracking of cast inconel 738LC superalloy welds", PhD Dissertation, University of Manitoba, Canada, 2005.
 
[2] "Nimonic 75 alloy, Special Metals Corporation". 2014.
 
[3] M. Pouranvari, A. Ekrami & A. Kokabi, "Microstructure development during transient liquid phase bonding of GTD-111 nickel-based superalloy", Journal of alloys and compounds. vol. 461, pp. 641-647, 2008.
 
[4] M. Haafkens & J. Matthey, "A new approach to the weldability of nickel-base As-cast and power metallurgy superalloys", Weld. Journal, vol. 61, pp. 25-30, 1982.
 
[5] M. Abdelfatah & O. Ojo, "On the extension of processing time with increase in temperature during transient-liquid phase bonding", Metallurgical and Materials Transactions A. vol. 40, pp. 377-385, 2009.
 
[6] J. Mattheij, "Role of brazing in repair of superalloy components–advantages and limitations", Materials science and technology. vol. 1, pp. 608-612, 1985.
 
[7] M. Mosallaee, A. Ekrami, K. Ohsasa & K. Matsuura, "Microstructural evolution in the transient-liquid-phase bonding area of IN-738LC/BNi-3/IN-738LC", Metallurgical and Materials Transactions A. vol. 39, pp. 2389-2402, 2008.
 
[8] F. Jalilian, M. Jahazi & R. Drew, "Microstructural evolution during transient liquid phase bonding of Inconel 617 using Ni–Si–B filler metal", Materials Science and Engineering: A. vol. 423, pp. 269-281, 2006.
 
[9] A. Rabinkin, "Brazing with (NiCoCr)–B–Si amorphous brazing filler metals: alloys, processing, joint structure, properties, applications", Science and Technology of Welding & Joining, vol. 9, pp. 181-199, 2004.
 
[10] D. Duvall, W. Owczarski & D. Paulonis, "TLP bonding: a new method for joining heat resistant alloys", Pratt and Whitney Aircraft, Middletown, CO. 1974.
 
[11] T. Shinmura, K. Ohsasa & T. Narita, "Isothermal Solidification Behavior During the Transient Liquid Phase Bonding Process of Nickel Using Binary Filler Metals". vol. 42, pp. 292-297, 2001.
 
[12] W. MacDonald & T. Eagar, "Transient liquid phase bonding processes", The Metal Science of Joining, pp. 93-100. 1992.
 
[13] W. Gale and D. Butts, "Transient liquid phase bonding", Science and Technology of Welding & Joining, vol. 9, pp. 283-300, 2004.
 
[14] M. Pouranvari, A. Ekrami & A. Kokabi, "Solidification and solid state phenomena during TLP bonding of IN718 superalloy using Ni–Si–B ternary filler alloy", Journal of Alloys and Compounds, vol. 563, pp. 143-149, 2013.
 
[15] M. Pouranvari, A. Ekrami & A. Kokabi, "Phase transformations during diffusion brazing of IN718/Ni-Cr-B/IN718", Materials Science and Technology, vol. 29, pp. 980-984, 2013.
 
[16] W. Gale & E. Wallach, "Microstructural development in transient liquid-phase bonding", Metallurgical Transactions A, vol. 22, pp. 2451-2457, 1991.
 
[17] "Alloy Phase Diagrams", 10 ed. ASM Handbook. Vol. 3, ASM International, 1992.
 
[18] P. Sung & D. Poirier, "Liquid-solid partition ratios in nickel-base alloys", Metallurgical and Materials Transactions A, vol. 30, pp. 2173-2181, 1999.
 
[19] A. Bondar, "B-Cr-Ni (Boron-Chromium-Nickel)", Non-Ferrous Metal Ternary Systems. Selected Soldering and Brazing Systems: Phase Diagrams, Crystallographic and Thermodynamic Data.
 
[20] K. Ohsasa, T. Narita & T. Shinmura, "Numerical modeling of the transient liquid phase bonding process of Ni using Ni-B-Cr ternary filler metal", Journal of phase equilibria, vol. 20, pp. 199-206, 1999.
 
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[22] W. Li, T. Jin, X. Sun, Y. Guo, H. Guan & Z. Hu, "Study of Ni–Cr–Co–W–Mo–B interlayer alloy and its bonding behaviour for a Ni-base single crystal superalloy", Scripta materialia, vol. 48, pp. 1283-1288, 2003.
 
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[31] M. Pouranvari, "Isothermal solidification during transient liquid-phase bonding of GTD-111/Ni-Si-B/GTD-111", Materiali in tehnologije. vol. 48, pp. 113-118, 2014.
 
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